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| 3.5x2.8 mm SMD CHIP LED LAMP PRELIMINARY SPEC Part Number: AA3529SES/L RED-ORANGE Features SINGLE COLOR. SUITABLE FOR ALL SMT ASSEMBLY AND SOLDER PROCESS. AVAILABLE ON TAPE AND REEL. IDEAL FOR BACKLIGHTING. WHITE SMD PACKAGE, SILICONE RESIN. LOW THERMAL RESISTANCE. PACKAGE: 1500PCS / REEL. MOISTURE SENSITIVITY LEVEL : LEVEL 2a. RoHS COMPLIANT. Description The Red-orange device is made with TS AlInGaP light emitting diode. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25(0.01") unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 1 OF 6 ERP: 1201002739 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Outside impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 2 OF 6 ERP: 1201002739 Selection Guide Part No. Dice Lens Type Iv (mcd) [2] @ 150mA Min. AA3529SES/L RED-ORANGE (AlInGaP) WATER CLEAR 3800 Typ. 6000 v (mlm) [2] @ 150mA Min. 2500 Typ. 4000 Viewing Angle [1] 21/2 120 Notes: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity / luminous flux: +/-15%. Electrical / Optical Characteristics at TA=25C Symbol peak D [1] 1/2 C VF [2] IR Parameter Peak Wavelength Dominant Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Device Red-orange Red-orange Red-orange Red-orange Red-orange Red-orange Typ. 626 618 20 25 2.9 3.5 10 Max. Units nm nm nm pF V uA Test Conditions IF=150mA IF=150mA IF=150mA VF=0V;f=1MHz IF=150mA VR = 5V Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25C Parameter Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating / Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Red-orange 525 150 350 5 -40C To +85C Units mW mA mA V SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 3 OF 6 ERP: 1201002739 Red-orange AA3529SES/L SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 4 OF 6 ERP: 1201002739 AA3529SES/L Recommended Soldering Pattern (Units : mm; Tolerance: 0.1) Tape Specifications (Units : mm) SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 5 OF 6 ERP: 1201002739 PACKING & LABEL SPECIFICATIONS AA3529SES/L SPEC NO: DSAH3956 APPROVED: WYNEC REV NO: V.4 CHECKED: Allen Liu DATE: JAN/14/2008 DRAWN: R.CHEN PAGE: 6 OF 6 ERP: 1201002739 |
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